Printed Circuit Boards
PRINTED CIRCUIT BOARDS
UMC Global manufactures Printed Circuit Boards, starting with simple Double Sided to Advanced Technology Multi Layer PCB’S. We offer High Temp & High Speed Materials, Controlled Impedance Designs, Chip On Board (COB) designs, Laser Drilled and Sequential Build Blind & Buried Micro Via’s, and fully RoHS compliant processes (Solder,Gold/Silver/Tin) and non-RoHS Tin/Lead solder.
We offer advanced technology quick turn PCB’s from Prototypes to High Volume Production.
- Rigid PCB’s (up to 30 layers)
-
Flex & Rigid Flex (1 to 12 layers)
- Controlled Impedance and Capacitance
- Blind and Buried Vias, Micro Via, Chip On Hole & Stack Via Technology
- Heavy Copper (up to 6 oz.)
Wide range of laminates – FR4 (Standard & High Temp/Tg, RoHS compliant), Getek, Rogers,Polyimide,CEM-1, CEM-3
Finishes – HASL (lead and lead free RoHS), Bondable Hard & Soft Gold (up to 180 u“), Selective Gold, Immersion Gold, Tin, Nickel, & Silver, ENTEK (OSP), Conductive Carbon Ink
Minimum Trace/Space – 0.003” (0.08mm)
Minimum Finished Hole – 0.006″ (0.2mm)
Oversized Boards (up to 37″x120″)
RoHS, ISO/TS, UL, IPC Class 2
Lead Times
Rigid PCB’s
- 5 days – Quick Turnaround
- 12 days – Standard
- Production lead times are dependent on order size
Flex PCB’s
- 2-3 weeks – flex and rigid flex
Soldermask
- LPI (multi colors, glossy, matte)
- Carbon Ink (w/ tolerances)
Testing
- Flying probe (fixtureless)
- Full Net List
- Controlled impedance verification
- Double sided test, 10-200 volt
- Continuity resistance, 10-30 ohms
- Isolation resistance, 2.5 to 10.0 MegOhms
Quality Systems: Our facilities are ISO 9001, ISO/TS16949 and ISO 14001 certified and must pass a rigorous annual qualification process to insure that our products meet or exceed our customers’ expectations.
Capabilities
| Board Features |
Standard |
Advanced |
| Lines and Spaces (Outer) |
.005″ |
.002″ |
| Lines and Spaces (Inner) |
.005″ |
.002″ |
| Outer Annual Ring |
.010″ |
<.003″ |
| Inner Annual Ring |
.010″ |
<.003″ |
| Hole to Plane Clearance or Conductor |
.020” |
.008” |
| Layer to Layer Registration (Core to Core) |
.005″ |
.002″ |
| Layer to Layer Registration (Top to Bottom) |
.005″ |
.002″ |
| PCB Thickness Tolerance |
10% |
.002″ |
| Finished Mechanical Drill Hole |
.012″ |
.005” |
| Finished Laser Drilled Holes |
.005″ |
.002″ |
| Aspect Ratio (=/> than .015″) |
8:1 |
17:1 |
| Controlled Impedance Characteristic |
10% |
5% |
| Differential |
10% |
5% |
| Fabrication Radius |
+/-10 degrees |
+/-5 degrees |
| Warpage: flatness of finished board (inch per inch) |
.010” |
.005” |
| Min Dielectric Thickness |
.006” |
.002” |
| LPI Soldermask (Dams) |
.005″ |
.002″ |
| Layer Count |
14 |
30 |
| Panel Sizes |
18 X 24” |
28 x 32” |
| Max Board Thickness |
.125” |
.400” |
| Min Board Thickness |
.030” |
.005” |
| Board Thickness Tolerance |
+/- 10% |
+/-5% |
| Tolerance- Plated Hole Size |
+/-0.005” |
+/-0.002″ |
| Min Outer Non Plated Hole to Metal |
0.010 |
0.008 |
| Min Inner Non Plated Hole to Metal |
0.010 |
0.008 |
| Max Number Holes per Square In(average over board) |
150 |
300 |
