Printed Circuit Boards

PRINTED CIRCUIT BOARDS

UMC Global manufactures Printed Circuit Boards, starting with simple Double Sided to Advanced Technology Multi Layer PCB’S. We offer High Temp & High Speed Materials, Controlled Impedance Designs, Chip On Board (COB) designs, Laser Drilled and Sequential Build Blind & Buried Micro Via’s, and fully RoHS compliant processes (Solder,Gold/Silver/Tin) and non-RoHS Tin/Lead solder.

We offer advanced technology quick turn PCB’s from Prototypes to High Volume Production.

  • Rigid PCB’s (up to 30 layers)
  • Flex & Rigid Flex (1 to 12 layers)

  • Controlled Impedance and Capacitance
  • Blind and Buried Vias, Micro Via, Chip On Hole & Stack Via Technology
  • Heavy Copper (up to 6 oz.)

shutterstock_139649372Wide range of laminates – FR4 (Standard & High Temp/Tg, RoHS compliant), Getek, Rogers,Polyimide,CEM-1, CEM-3

Finishes – HASL (lead and lead free RoHS), Bondable Hard & Soft Gold (up to 180 u“), Selective Gold, Immersion Gold, Tin, Nickel, & Silver, ENTEK (OSP), Conductive Carbon Ink

Minimum Trace/Space – 0.003” (0.08mm)

Minimum Finished Hole – 0.006″ (0.2mm)

Oversized Boards (up to 37″x120″)

RoHS, ISO/TS, UL, IPC Class 2

Lead Times

Rigid PCB’s

  • 5 days – Quick Turnaround
  • 12 days – Standard
  • Production lead times are dependent on order size

Flex PCB’s

  • 2-3 weeks – flex and rigid flex

Soldermask

  • LPI  (multi colors, glossy, matte)
  • Carbon Ink (w/ tolerances)

Testing

  • Flying probe (fixtureless)
  • Full Net List
  • Controlled impedance verification
  • Double sided test, 10-200 volt
  • Continuity resistance, 10-30 ohms
  • Isolation resistance, 2.5 to 10.0 MegOhms

Quality Systems: Our facilities are ISO 9001, ISO/TS16949 and ISO 14001 certified and must pass a rigorous annual qualification process to insure that our products meet or exceed our customers’ expectations.

Capabilities

Board Features

Standard

Advanced

Lines and Spaces (Outer)

.005″

.002″

Lines and Spaces (Inner)

.005″

.002″

Outer Annual Ring

.010″

<.003″

Inner Annual Ring

.010″

<.003″

Hole to Plane Clearance or Conductor

.020”

.008”

Layer to Layer Registration (Core to Core)

.005″

.002″

Layer to Layer Registration (Top to Bottom)

.005″

.002″

PCB Thickness Tolerance

10%

.002″

Finished Mechanical Drill Hole

.012″

.005”

Finished Laser Drilled Holes

.005″

.002″

Aspect Ratio (=/> than .015″)

8:1

17:1

Controlled Impedance Characteristic

10%

5%

Differential

10%

5%

Fabrication Radius

+/-10 degrees

+/-5 degrees

Warpage: flatness of finished board (inch per inch)

.010”

.005”

Min Dielectric Thickness

.006”

.002”

LPI Soldermask (Dams)

.005″

.002″

Layer Count

14

30

Panel Sizes

18 X 24”

28 x 32”

Max Board Thickness

.125”

.400”

Min Board Thickness

.030”

.005”

Board Thickness Tolerance

+/- 10%

+/-5%

Tolerance- Plated Hole Size

+/-0.005”

+/-0.002″

Min Outer Non Plated Hole to Metal

0.010

0.008

Min Inner Non Plated Hole to Metal

0.010

0.008

Max Number Holes per Square In(average over board)

150

300