UMC Global Worldwide Sourcing | A RoHS Compliant Company

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PCP Capabilities

Multi Layers Up to 16 Layers
Thin PCB's 4 Layer –.011"(0.30 mm) 6 Layer – .015" (0.40 mm)
Thickest PCB's – .200" (5.08 mm)
RCC Build Up PCB's
Sequentially Laminated PCB's

Chip on Board for Gold / Aluminum Wire Bonding

Controlled Impedance PCB's

Finishes : HASL, ENTEK, Immersion Gold, Immersion Silver,
Immersion Tin, Gold Finger
Stack Via technology
Laser Micro Via capable
Blind and Buried Via PCB's
Min. Trace/Space - .002" (0.075 mm)
Min. Drill Hole(Laser) -.003" (0.10mm)